We Manufacture semiconductors
and various sensor packages at the high-security factory
We are doing semiconductor assembly all through from wafer back-grind to packing/taping.
We provide security and satisfaction for our customers through various kinds of packages and high-security management.
Products and Services
・Packaging and testing of various semiconductors
・Packaging, burn-in, and testing of automotive semiconductors
・Packaging and testing of high-security semiconductors in a high-security environment
・Risk dispersion by production in Vietnam and Japan
・Development of new packages
・Development of test programs
・Various simulation analysis before trial production
Package simulation analysis
We offer the packages requested by our customers from a wide range of package lineups.
We can also develop custom packages that are not included in our product lineup.
We provide our customers with packages and technologies realized through collaboration among our internal businesses.
List of Analysis Equipment
|In-Process Inspection Apparatus||Analyzer||Reliability Test Apparatus|
|Wire-bonding pull tester||Scanning acoustic tomograph||Thermohygrostat|
|X-ray inspection apparatus||Scanning electron microscope||Thermostatic chamber|
|Multi solderability tester||Specimen polisher||Hot air reflow soldering equipment|
|Solder bath||Flow analysis software||Gas-tank thermal shock tester|
|X-ray fluorescence thickness meter||Spectrum analyzer||Unsaturated pressure cooker|
|Surface roughness tester|
|Oscilloscope / Curve tracer||ー|
|Tabletop load measuring instrument||Memory checker||ー|
|Measuring microscope||High precision digital multimeter||ー|
|Toolmaker's microscope||High precision frequency counter||ー|
|Dew point meter||ー||ー|
|Static electricity measuring instrument||ー||ー|
|Surface resistance measuring instrument||ー||ー|
Focusing on ultra-precision processing technology, we are developing four businesses: semiconductor assembly business, plastic molding business, equipment business, and automotive parts business. Our strength is that we can develop new products that combine each other's technologies and build highly efficient production lines using our unique technologies while developing our business independently.