Achieve a hollow package that meets your requirements and functions with PLAPACS®
Our in-house design allows us to flexibly meet the needs of our customers.
Resin design: We offer the optimal resin for the product through the in-house design.
Product design: We realize the design of products with high efficiency and high quality in cooperation with the in-house design of molding dies.
Production equipment: We are in-house developing efficient dedicated equipment.
What is PLAPACS®
PLAPACS® is a plastic cavity package suitable for CCD/CMOS image sensors and other sensors. PLAPACS® has high dimensional precision and high humidity resistance by our unique epoxy resin compound and technology for composite metal and material.
- High dimensional precision
- High humidity resistance
- Low cost
Feature of PLAPACS®
・High dimensional precision & Lightweight
Using our resin-design and transfer-molding technology, we achieve drastically accurate dimensions.
|Dimensional Items||PLAPACS®(Large)||PLAPACS®(Small, 1/3")||Ceramics(An Example)|
|Outside Dimensional Tolerance||±50µm||±30µm||±50-200µm|
|Flatness of Seal Area||≤50µm||≤15µm|
|Flatness of Die Attach Area||≤50µm||≤10µm|
|Parallelism of Seal Area||≤50µm||≤15µm|
|Parallelism of Die Attach Area||≤50µm||≤10µm|
・High Humidity Resistance of PLAPACS®
Application of PLAPACS®
- Digital still camera
- Digital video camera
- Surveillance camera
- On-vehicle camera
- Various sensors
We propose a hollow plastic package that has high moisture resistance and high dimensional accuracy by using our original resin compounding technology and our own mold processing technology.
Focusing on ultra-precision processing technology, we are developing four businesses: semiconductor assembly business, plastic molding business, equipment business, and automotive parts business. Our strength is that we can develop new products that combine each other's technologies and build highly efficient production lines using our unique technologies while developing our business independently.